JPH02126754U - - Google Patents
Info
- Publication number
- JPH02126754U JPH02126754U JP3255789U JP3255789U JPH02126754U JP H02126754 U JPH02126754 U JP H02126754U JP 3255789 U JP3255789 U JP 3255789U JP 3255789 U JP3255789 U JP 3255789U JP H02126754 U JPH02126754 U JP H02126754U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- wiring board
- flat plate
- polishing
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3255789U JPH02126754U (en]) | 1989-03-24 | 1989-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3255789U JPH02126754U (en]) | 1989-03-24 | 1989-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02126754U true JPH02126754U (en]) | 1990-10-18 |
Family
ID=31535577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3255789U Pending JPH02126754U (en]) | 1989-03-24 | 1989-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02126754U (en]) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6053461B2 (ja) * | 1976-03-06 | 1985-11-26 | ソニー株式会社 | シリコンウエハの結晶欠陥の険出に用いるエッチング液 |
-
1989
- 1989-03-24 JP JP3255789U patent/JPH02126754U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6053461B2 (ja) * | 1976-03-06 | 1985-11-26 | ソニー株式会社 | シリコンウエハの結晶欠陥の険出に用いるエッチング液 |
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